汪正平教授

香港城市大学香港高等研究院资深院士

香港城市大学香港高等研究院资深院士

香港中文大学荣休教授

美国国家工程院院士

中国工程院外籍院士

香港科学院创院院士

Professor Ching Ping Wong

联络资料

办公室: Rm 209, Ho Sin Hang Engineering Building, CUHK
电话: +852 3943 8298
电邮: cpwong@cuhk.edu.hk
Professor Ching Ping Wong, a world-renowned scholar in electronic engineering, is currently the Emeritus Professor at The Chinese University of Hong Kong (CUHK). He was appointed as the new Dean of Engineering at CUHK in 2010.

Professor Wong received his BS degree from Purdue University, and his PhD degree from the Pennsylvania State University. After his doctoral study, he was awarded a postdoctoral fellowship under Nobel laureate Professor Henry Taube at Stanford University. Prior to joining Georgia Institute of Technology (GT), he was with AT&T Bell Laboratories for many years and became an AT&T Bell Laboratories Fellow in 1992.

Professor Wong’s research interests lie in the fields of polymeric electronic materials, electronic, photonic and MEMS packaging and interconnect, interfacial adhesions, and nano-functional material syntheses and characterizations.

Professor Wong has published widely with over 900 technical papers. He has yielded fruitful research results and holds over 50 US patents. Professor Wong is considered an industry legend and has made significant contributions to the industry by pioneering new materials, which fundamentally changed the semiconductor packaging technology.

Professor Wong has successfully motivated and nurtured numerous inquisitive young minds over the years. As a distinguished scholar, Professor Wong was awarded numerous international honours, such as the IEEE CPMT Society Outstanding Sustained Technical Contributions Award in 1995, the IEEE Third Millennium Medal in 2000, the IEEE EAB Education Award in 2001, the IEEE CPMT Society Exceptional Technical Contributions Award in 2002, the Georgia Tech Class 1934 Distinguished Professor Award in 2004, named holder of the Charles Smithgall Chair (one of the two GT Institute Chairs) in 2005, the GT Outstanding PhD Thesis Advisor Award, the IEEE Components, Packaging and Manufacturing Technology Field Award in 2006, the Sigma Xi’s Monie Ferst Award in 2007, the Society of Manufacturing Engineers’ Total Excellence in Electronic Manufacturing Award in 2008 and the IEEE CPMT David Feldman Award in 2009. He has recently received the The Pennsylvania State University Outstanding Science Alumni Award.