Professor Ching Ping Wong Explores Advanced Semiconductor and Photonic Packaging for AI at CityUHK
Professor Ching Ping Wong, an HKIAS Senior Fellow and a pioneering figure in materials science and semiconductor packaging, visited City University of Hong Kong (CityUHK) from 3 to 11 May 2026. His visit featured an inspiring distinguished lecture and academic exchanges aimed at fostering collaboration in advanced packaging technologies and microelectronics, while inspiring faculty, students, and the wider scientific community.
Throughout his visit, Professor Wong engaged in a series of in-depth discussions with prominent scholars across CityUHK, including Professor Jian Lu, Dean of the College of Engineering; Professor Yingxia Liu, Associate Professor in the Department of Systems Engineering; and Professor Zhao Yang Dong, Head of the Department of Electrical Engineering. These exchanges provided valuable opportunities to share research insights, explore future scientific advancements, and catalyze interdisciplinary collaborations that align CityUHK’s research trajectories with the forefront of AI and telecommunications standards.
On 7 May 2026, Professor Wong delivered the HKIAS Distinguished Lecture titled “Recent Advances on Heterogeneous System Integration of Electronic and Photonic Packaging for Co-Packaged of Optics (CPO) and Artificial Intelligence (AI)”. The lecture addressed the rapid evolution of optical interconnect systems in data centers, reviewing the transition from pluggable optics to near-package optics and CPO. Professor Wong explained how heterogeneous integration combining photonic ICs (PICs) and electronic ICs (EICs) on advanced substrates can deliver higher bandwidth density, reduced electrical losses, and improved energy efficiency for future AI data-center networks. He also shared his research group’s latest breakthroughs in underfill materials for Advanced Flip-Chip Interconnects and thermal interface materials (TIMs) for advanced semiconductor packaging. The highly successful lecture drew a large and enthusiastic audience of researchers, students, and faculty members who joined the event to engage with his cutting-edge insights. (For more information about the lecture, please click here.)
Professor Wong is currently a Regents’ Professor and the Charles Smithgall Institute-Endowed Chair in the School of Materials Science and Engineering at the Georgia Institute of Technology. His groundbreaking research interests span polymeric electronic materials, electronic, photonic, and MEMS packaging, interfacial adhesions, nano-functional materials, and perovskite solar cells for energy storage.
With over 858 peer-reviewed journal papers, more than 1,000 conference proceedings, and over 65 US patents, Professor Wong has made monumental contributions to the microelectronics industry. His pioneering work in developing novel packaging materials fundamentally transformed semiconductor manufacturing, enabling smaller, higher-performance, and lower-cost integrated circuits (ICs) that made modern smartphones and high-performance computing systems accessible to consumers worldwide. In recognition of his extraordinary scientific achievements, Professor Wong is a member of the US National Academy of Engineering (elected in 2000), a foreign academician member of the Chinese Academy of Engineering (elected in 2013), and an Academician of the Academia Sinica (elected in 2022).
Professor Wong’s engagements at CityUHK strongly reinforce the university’s strategic focus on driving innovation in next-generation semiconductors and AI packaging. HKIAS extends its warmest thanks to Professor Wong for generously sharing his visionary expertise, which has deeply inspired our scholars and laid a solid foundation for future breakthroughs within the community.